66 standard models across 9 series — plus custom OEM / ODM engineering to your drawings.

1 kV to 30 kV DC power feedthroughs with ceramic vacuum seals, CF / KF flanges for ultra-high-vacuum systems.
View series → 10 models
MIL-Spec MS series, USB and SUB-D multipin feedthroughs with gold-plated pins and UHV hermetic seals.
View series → 16 models
BNC, MHV, N, SHV, SMA and SMB 50 Ω coaxial feedthroughs up to 20 kV, transmission to 1 GHz.
View series → 3 models
10 kV / 30 kV / 50 kV ceramic breaks with gold-plated conductors for electrical isolation in vacuum lines.
View series → 2 models
Type C (0–2320 °C) and Type K (–200–1200 °C) thermocouple feedthroughs, 1 to 4 pairs.
View series → 2 models
Fused silica and sapphire viewports, 180–5000 nm transmission, custom AR coatings available.
View series → 12 models
Thick-film, thin-film and active metallization for 95–99.7% alumina, AlN, beryllia, sapphire and more.
View series → 2 models
Alumina, AlN and zirconia precision ceramics, CNC machined to ±0.01 mm tolerances.
View series → 11 models
Ceramic-to-metal brazed assemblies for photomultipliers, TWTs, microwave tubes, X-ray systems and more.
View series →
1 kV DC power feedthrough with copper / nickel / molybdenum conductors, 1–8 pins, ceramic vacuum seal.

5 kV DC power feedthrough rated up to 90 A for medium-power vacuum systems.

8 kV DC power feedthrough rated up to 800 A for high-power vacuum systems.

12 kV DC power feedthrough, 50–145 A, multiple flange and pin configurations.

12 kV baseplate feedthrough designed for electron-beam welding and processing machines.

14 kV DC power feedthrough with stainless steel, nickel, molybdenum or copper conductors.

20 kV DC power feedthrough, 1–4 pins, multiple lengths and flange sizes for different chamber layouts.

30 kV high-voltage feedthrough with long creepage path for HV vacuum and accelerator applications.

2-pin MIL-spec multipin feedthrough with MIL-C-5015 atmosphere-side interface.

4-pin MIL-spec multipin feedthrough with nickel / molybdenum conductors and thermocouple pin options.

6-pin MIL-spec feedthrough supporting nickel, molybdenum and thermocouple (Chromel-Alumel) pins.

10-pin MIL-spec multipin feedthrough in a compact flange design.

20-pin MIL-spec multipin feedthrough with high-density pin layout.

35-pin MIL-spec multipin feedthrough for complex multi-channel signal transmission.

Double-ended MIL-C-26482 circular connector feedthrough, gold-plated pins, 3 to 41 pins.

USB 2.0 vacuum feedthrough, male / female Type A, for data transmission into vacuum chambers.

9-pin sub-miniature multipin feedthrough with gold-plated pins, 500 V DC rating.

9 / 15 / 25 / 37 / 50-pin USB-D push-on multipin feedthrough, gold-plated pins.

50 Ω BNC coaxial feedthrough, single-face grounding shield, Kovar conductor.

50 Ω BNC coaxial feedthrough with floating shield for isolation applications.

5 kV high-voltage coaxial feedthrough, single-face grounding shield, stainless steel conductor.

5 kV high-voltage coaxial feedthrough, single-face floating shield.

N-type coaxial feedthrough, transmission up to 1 GHz, 1.5 kV DC rating.

Sub-miniature coaxial feedthrough, 500 V DC, compact design.

5 kV high-voltage coaxial feedthrough, single-face grounding shield.

5 kV coaxial feedthrough with grounding shield and exposed ceramic insulator.

5 kV high-voltage coaxial feedthrough, single-face floating shield.

10 kV high-voltage coaxial feedthrough, grounding shield with exposed insulator.

10 kV high-voltage coaxial feedthrough, single-face grounding shield.

20 kV high-voltage coaxial feedthrough, single-face grounding shield, nickel conductor.

20 kV coaxial feedthrough, grounding shield with exposed ceramic insulator.

50 Ω SMA coaxial feedthrough, transmission up to 1 GHz, single-face grounding shield.

50 Ω SMA coaxial feedthrough, double-face floating shield.

50 Ω SMA coaxial feedthrough, single-face grounding shield, compact design.

10 kV ceramic break for electrical isolation in vacuum lines, CF16 to CF200 flanges.

30 kV ceramic break with extended creepage distance for high-voltage isolation.

50 kV ultra-high-voltage ceramic break for accelerators and HV isolation systems.

Type C (tungsten-rhenium) thermocouple feedthrough, 0 to 2320 °C, 1 to 4 pairs.

Type K (NiCr-NiSi) thermocouple feedthrough, -200 to 1200 °C, 1 to 4 pairs.

Fused silica viewport, 200–3500 nm transmission, custom AR coatings available.

Sapphire viewport, 180–5000 nm transmission, high-temperature and corrosion resistant.

95% / 99% / 99.7% alumina ceramics: high density, high insulation and mechanical strength for vacuum and semiconductor parts.

AlN, zirconia, SiC and other structural ceramics for high-temperature, high-thermal-conductivity and wear applications.

95% alumina ceramic metallization for brazed packaging.

High-density metallized ceramic substrates with excellent flatness.

Metallized ceramic parts for ceramic-to-metal sealing.

AlN ceramic metallization for high-thermal-conductivity applications.

Metallization of complex-shape ceramic components.

95% – 99.7% alumina metallization, helium leak tested.

Metallized ceramics for electron vacuum devices.

Sapphire / ceramic surface metallization.

Precision metallized ceramic envelopes and housings.

Large-size ceramic metallization assemblies.

Thin-film metallized ceramic substrates.

Active metal brazing metallization with Mo-Mn / W layers.

Ceramic-to-metal brazed assembly (standard type).

Brazed assemblies for travelling wave tubes and microwave tubes.

Photomultiplier tube envelope assemblies.

Ceramic-to-metal components for X-ray systems.

Image intensifier housing assemblies.

Ceramic-metal sealed parts for vacuum chambers.

High-voltage insulation brazed assemblies.

High-current ceramic-to-metal feedthrough assemblies.

Brazed assemblies for electron-beam devices.

Custom-engineered brazed assemblies.

Multi-material composite brazed assemblies.