Practical engineering knowledge on ceramic-to-metal sealing, vacuum feedthroughs, metallization and materials — written by our engineers.

How ceramic-to-metal seals are made: metallization, brazing and design rules for UHV-grade hermetic ceramic-metal components.
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A practical selection guide for vacuum feedthroughs: voltage, current, flange, conductor material, and application-specific considerations.
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Compare Mo-Mn thick film, sputtered thin film and active metal brazing metallization processes for alumina and AlN ceramics.
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Compare alumina, aluminium nitride and sapphire for vacuum and semiconductor components: thermal, electrical and mechanical properties explained.
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CF (ConFlat) vs KF (ISO-KF) vacuum flanges: sealing mechanism, bakeout, materials and how to choose the right port for your feedthrough.
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Type C (tungsten-rhenium) vs Type K thermocouple feedthroughs: temperature range, accuracy, materials and vacuum applications.
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1 kV to 30 kV DC power feedthroughs with ceramic vacuum seals, CF / KF flanges for ultra-high-vacuum systems.
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MIL-Spec MS series, USB and SUB-D multipin feedthroughs with gold-plated pins and UHV hermetic seals.
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BNC, MHV, N, SHV, SMA and SMB 50 Ω coaxial feedthroughs up to 20 kV, transmission to 1 GHz.
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